While the market has been reeling in anticipation of the upcoming iPhone 17 a slew of new leaks and ideas have surfaced about the next year’s iPhone 18 as well.  Recently in a research note with the investment firm Gf securities, Analyst Jeff Pu reported that the A20 chip for the iPhone 18 models would be manufactured with TSMC’s second gen 3Nm process, known as 3NP.

This would be the same process that would be used for the production of A19 and A19 pro chips as well. So as per the information it has become evident that the new iPhone 18 would have overall upgraded performance than the other previous generation. 

Leaks About C2 Modem Chip

As per further updates by Jeff Pu, the new chips would have a upgrade which would be a Chip ON Wafer On Substrate(COWOS) packaging technology. This new technology would allow for integration of the chip’s processor, Unified memory as well as Neural Engine. 

Beyond that another leak by Jeff Pu has revealed that the upcoming new iPhone 17 air would be powered by the same C1 modem tech as that of the 16e. There were expectations in the market that Apple might bring in a new C2 modem chip with the iPhone 17 series but as of yet these expectations have been quashed. 

The C2 modem chip would most probably be introduced with the new iPhone 18 only. Manufacturers often prepare for modem chips way before they are fitted to prototype phones, hence its possible that Apple might as of now be working on the Generation C2 and C3 modems. 

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