New Delhi, Feb 27: Nokia smartphones manufacturer HMD Global unveiled five new devices -- Nokia 8 Sirocco, Nokia 7 Plus, Nokia 6 (new variant), Nokia 1 and a revamped Nokia 8110 at Mobile World Congress 2018 (MWC) event at Barcelona.
Nokia 8 Sirocco was launched with Snapdragon 835 while most of the companies came up with Qualcomm’s freshly launched Snapdragon 845 processor which also hints at a lower price compared to other competing smartphones
Going by the design, the Nokia 8 Sirocco is carved from a single block of stainless steel and company claims it as two and a half times as strong as aluminium and giving Nokia 8 Sirocco a slick look and feel.
Apart from stainless steel, 95 percent of the outer surface of Nokia 8 Sirocco is glass which picks up smudges and fingerprints forcing the buyers to wipe it constantly.
If specifications are concerned, Nokia 8 Sirocco features a 5.5-inch POLED panel with a QHD resolution, which means it is 16:9 and users will lose a little bit of screen space because of the curves which make it hard to focus on full-screen videos and games.
Nokia 8 Sirocco is 7.5mm thin but gets a lot thinner at the edges making it little hard to grip. It will also support Qi wireless charging thanks to the glass back.